● 2008 Taiwan ANSYS/Fluent Conference (更多資訊 )

● 2008 國際構裝、電子材料、電路板技術聯合研討會 即日起開放投稿 !! (更多資訊 )

● 2007/10/1~2007/10/3 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference

●2007/10 協助半導體學院規劃封裝領域課程

●2007/8/14~2007/8/17 第八屆International Conference on Electronics Packaging Technology (ICEPT 2007)

●2007/9 協助半導體學院建立封裝在職工程師檢定題庫(擬頒發蓋有IMAPS的證書)

●2007/5/15 協助同欣電子徵才求職之訊息並分發招募海報

●2006/12/28 演講：MEMS/NEMS Devices and Packaging

●2006/11/6 異質整合與先進封裝技術及其應用研討會

●2006/10/20 Professor AVRAM BAR-COHEN “Thermal Packaging Challenges and Opportunities at the Micro and Nano Scales”

●2006/10/18~2006/10/20 IMPACT 研討會

●2006/9/29 認證課程(IC封裝人才訓練課程認證)