Organization

• American Electronics Association
• EIA - Electronics Industry Association
• IEEE- The Institute of Electrical and Electronics Engineers
• IEEE's Components, Packaging, and Manufacturing Technology (CPMT) Society
• IMAPS- The International Microelectronics and Packaging Society
• IPC - The Institute for Interconnecting and Packaging Electronic Circuits
• ISO - International Organization for Standardization
• JEDEC - Joint Electron Device Engineering Committee (EIA)
• National Association of Purchasing Management
• STC - Semiconductor Technology Center
• SEMATECH
• SEMI - Semiconductor Equipment and Materials International
• SMART Group UK
• SMEMA - Surface Mount Equipment Manufacturers Association
• SMTA - Surface Mount Technology Association

Exhibition

• APCOM - International Assembly and Packaging Foundry Conference
• SEMICON 

Industry resources

• ElectroBase
• Semiconductor Online
• SMTnet

Research Organizations

• Dataquest
• Technology Forecasters
• TechSearch

University

• Georgia Tech Microsystems Packaging Research Center

• University of Maryland calce

• The Hong Kong University of Science & Technology

Publications

• Circuits Assembly
• EDN Magazine 
• Electronic News
• Manufacturing Market Insider
• Semiconductor International
• Semiconductor Manufacturing

Advanced Packaging

• Amkor
• ASAT
• ASE
• ChipPAC
• ChipScale
• Chip Supply
• Flip Chip Technologies
• IBM Microelectronics
• IPAC
• Kyocera
• Nextek
• Tessera
• Tong Hsing Electronincs

Materials

• Alphametals
• Ablestik
• Aimsolder
• Dexter Electronic Materials
• Indium
• Kester
• Qualitek

Services

• Polyflex

Equipment

• Asymtek
• BTU
• Cognex
• Conceptronic
• Cyberoptics
• DEK
• Fuji
• Heller
• K&S
• Mydata
• Research
• SIKAMA
• Universal
• Vanguard Automation
• View Engineering

Japanese Pages

• http://www.nikkan.co.jp/
• http://www.nikkeibp.co.jp/biztech/index.html
• Nikkei Micro Device

• Finite Element Resources on Internet
  • Finite Element Analysis
  • finite element mesh generation
  • Finite Element Resources

• Who Is Doing CAE Research
  • Computational Solid Mechanics Laboratory(UC Berkeley,ME)
  • Department of Civil Engineering, National Taiwan University

• Misc
  • IGES CM & In-work Items

• User Groups
  • Finite Element Modeling Continuous Improvement (FEMCI)

• Download Finite Element Programs
  • FElt

• CAD/CAM/CAE Vendors
  • Software Vendors
    • ADINA
    • Algor
    • Altair Computing
    • Ansys Inc.
    • Autodesk
    • Catia
    • Computational Engineering International
    • Computational Mechanics Home Page
    • COSMOS
    • DataCAD Home Page
    • Engineering Technology Associates, Inc.(ETA)
    • Intergraph 
    • Microstation 
    • PROTOCAM - EXCELLENCE IN RAPID PROTOTYPING ?
    • PTC (Pro-Engineer)
    • Visual CADD Home Page

• CAD/CAM/CAE Service Vendors
  • Altair Engineering
  • ARSoftware's Online Internet Catalog of Scientific and Technical Software
  • Ashlar
  • CADDman Home Page
  • Intergraph
  • Mountain CAD
  • OpenCAD International, Inc.

On-line tools

• Searching about electron diction

On-line paper searching

• NTHU database
• IEEE XPLORE
• Applied Physics Letter
• Physical Review Letter
• Science
• Nature
• Nanotech resources online

• National sciense Council periodical

• Electronic Theses and Dissertations System

• Searching dissertationcitation

• Sciencecape
  
  

On-line patent searching

• Searching American patent

• TIPO

• Taiwan patent database

• European Patent Office

• Patent becomes PDF