The Advanced Packaging Research Center (APRC) was established in Jan 2006 and comprises five departments, namely the Power Mechanical Department, the Material Science and Engineering Department, the Chemical Engineering Department, the Industrial Engineering and Engineering Management Department, and the Institute of Microelectromechanical Systems, with over 15 faculties that offer expertise in the area of advanced package related technologies. The APRC performs multidisciplinary research, knowledge sharing, technology/IP transfer, course training, conferences/workshops, certificates in packaging technology, industry/research institute cooperation, etc., and the next generation packaging technology is the focus of this center's work. The APRC pursues basic/applied research and training programs in the areas of 3D packaging; 3D IC; wafer level packaging, system-in-packaging; microsystem packaging; electronics materials; reliability assessment; flexible electronics; optical-electronic packaging; nano-structure technology; semiconductor micro-/nano-mechanics; and simulation and testing, which offers solutions to advanced packaging technologies.